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Home Intel® Processors Intel® Core™ i3 Mobile Processor Intel® Core™ i3-2300 Mobile Processor Series i3-2310M Intel® Core™ i3-2310M Processor (3M Cache, 2.10 GHz) “Announced” SKUs are not yet available. Please refer to the Launch Date for market availability. The Intel Core i3-2310M is a dual core processor for laptops. Escan serial key free download. It is based on the Sandy Bridge architecture and offers Hyperthreading to handle 4 threads at once (for a better usage of the pipeline).

Sandy Bridge is the evolutionary successor of the Arrandale architecture. The most noteable improvements are the new 256Bit AVX instructions, the improved Turbo 2.0 and the integration of the graphics card into the 32nm CPU core. Der i3-2310M offers an integrated graphics card ( ) which is clearly faster then the older in the Arrandale CPUs. As the new GPU is included in the CPU, it is also manufactured in 32nm and shares the fast level 3 cache with the CPU cores (using a new ring bus).

In the 2310M it is clocked from 650-1100MHz (with Turbo Boost). The faster Sandy Bridge CPUs are clocked up to 1300 MHz (like the ). Furthermore, an improved dual-channel DDR3 memory controller is included on the CPU die that is used by the CPU and GPU part. Due to the improved architecture, the average performance of the Core i3-2310M is higher than a similar clocked Arrandale Core i3 without Turbo Boost. In synthetic benchmarks, the performance was about on par with the faster clocked Core i5-430M (2.3-2.5 GHz) and therefore adequate for most applications.

The 35W TDP rating includes the integrated GPU and memory controller. Series Intel Core i3 Codename Sandy Bridge Series: Core i3 Sandy Bridge () 2400 MHz 2 / 4 3 MB () 2300 MHz 2 / 4 3 MB () 2300 MHz 2 / 4 3 MB () 2200 MHz 2 / 4 3 MB () 2200 MHz 2 / 4 3 MB () 2100 MHz 2 / 4 3 MB » Intel Core i3-2310M 2100 MHz 2 / 4 3 MB () 2100 MHz 2 / 4 3 MB () 1500 MHz 2 / 4 3 MB () 1500 MHz 2 / 4 3 MB () 1400 MHz 2 / 4 3 MB () 1400 MHz 2 / 4 3 MB () 1300 MHz 2 / 4 3 MB Clock Rate 2100 MHz Level 1 Cache 128 KB Level 2 Cache 512 KB Level 3 Cache 3 MB Number of Cores / Threads 2 / 4 Max. Power Consumption (TDP = Thermal Design Power) 35 Watt Transistor Count 624 Million Manufacturing Technology 32 nm Die Size 149 mm 2 Max. Temperature 85 (PGA); 100(BGA) °C Socket rPGA988B / BGA1023 Features HD Graphics 3000 (650-1100MHz), DDR3-1066/1333 Memory Controller (max 8GB), HyperThreading, AVX, Quick Sync, Virtualization GPU (650 - 1100 MHz) 64 Bit 64 Bit support Announcement Date Product Link (external) Benchmarks. Model GPU Memory Core / Memory GPU Memory Value Samsung RF511-S01PL GeForce GT 540M 4096 MB 1024MB DDR3 and Intel HD Graphics 3000 ForceWare 66.10 1.9 HD Graphics 3000 4096 MB 1.96 HP ProBook 4330s XX946EA HD Graphics 3000 3072 MB 8.